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d a t a sh eet product speci?cation file under integrated circuits, ic01 january 1992 integrated circuits TDA1510AQ 24 w btl or 2 x 12 w stereo car radio power amplifier
january 1992 2 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ general description the TDA1510AQ is a class-b integrated output amplifier encapsulated in a 13-lead single in-line (sll) plastic power package. developed primarily for car radio application, the device can also be used to drive low impedance loads (down to 1,6 w ). with a supply voltage (v p ) of 14,4 v, an output power of 24 w can be delivered into a 4 w bridge tied load (btl), or when used as a stereo amplifier, 2 12 w into 2 w or 2 7 w into 4 w . features flexibility - stereo as well as mono btl low offset voltage at the output (important for btl) load dump protection a.c. short-circuit-safe to ground low number, small sized external components internal limiting of bandwidth for high frequencies high output power large useable gain variation good ripple rejection thermal protection low stand-by current possibility high reliability. quick reference data package outline TDA1510AQ: 13-lead sil-bent-to-dil; plastic power (sot 141c); sot141-6; 1996 aug 01. parameter conditions symbol min. typ. max. unit supply voltage range: operating v p 6,0 14,4 18,0 v non-operating v p -- 28,0 v non-operating, load dump protection v p -- 45,0 v repetitive peak output current i orm -- 4,0 a total quiescent current i tot - 75 120 ma stand-by current i sb -- 2ma switch-on current i so 0,15 0,35 0,80 ma input impedance pins 1, 2, 12 and 13 |z i |1 -- m w storage temperature range t stg - 65 -+ 150 c crystal temperature t c -- 150 c
january 1992 3 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ fig.1 functional diagram; heavy lines indicate signal paths.
january 1992 4 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ ratings limiting values in accordance with the absolute maximum system (iec 134) parameter conditions symbol min. max. unit supply voltage: operating pin 10 v p - 18 v non-operating v p - 28 v non-operating, load dump protection during 50 ms v p - 45 v peak output current i om - 6a total power dissipation see fig.2 p tot storage temperature range t stg - 65 + 150 c crystal temperature t c -+ 150 c fig.2 power derating curves.
january 1992 5 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ heatsink design example the derating of the encapsulation requires the following external heatsink (for sine-wave drive): (r th j-mb ) = 3,5 k/w 24 w btl (4 w ) or 2 12 w stereo (2 w ); maximum sine-wave dissipation = 12 w; t amb =65 c (maximum): 2 7 w stereo (4 w ); maximum sine-wave dissipatio n = 6 w; t amb =65 c (maximum): d.c. characteristics parameter conditions symbol min. typ. max. unit supply voltage range v p 6,0 14,4 18,0 v repetitive peak output current i orm -- 4,0 a total quiescent current i tot - 75 120 ma stand-by current i sb -- 2ma switch-on current v 11 v 10 ; note 1 i so 0,15 0,35 0,80 ma r th h-a 150 65 C 12 ---------------------- 3,5 3,5 k/w = C = r th h-a 150 65 C 12 ---------------------- 3,5 10,5 k/w = C =
january 1992 6 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ a.c. characteristics t amb =25 c; v p = 14,4 v; f = 1 khz; unless otherwise speci?ed parameter conditions symbol min. typ. max. unit bridge tied load application (btl) output power with bootstrap note 6; r l = 4 w v p = 13,2 v d tot = 0,5% p o - 15,0 - w d tot = 10% p o - 20,0 - w v p = 14,4 v d tot = 0,5% p o 15,5 18,0 - w d tot = 10% p o 20,0 24,0 - w open loop voltage gain g o - 75 - db closed loop voltage gain note 2 g c 39,5 40,0 40,5 db frequency response at - 3 db; note 3 f r - 20 to > 20 k - hz input impedance note 4 |z i |1 -- m w noise output voltage (r.m.s. value) f = 20 hz to 20 khz r s = 0 w v n (rms) - 0,2 - mv r s = 10 w v n (rms) - 0,35 0,8 mv r s = 10 k w ; according to iec 179 curve a v n (rms) - 0,25 - mv supply voltage ripple rejection f = 100 hz; note 5 svrr 42 50 - db d.c. output offset voltage between channels | d v 5-9 | - 250mv power bandwidth - 1 db; d tot = 0,5% b - 30 to > 40 k - hz
january 1992 7 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ stereo application output power; with bootstrap note 6; r l = 4 w v p = 13,2 v d tot = 0,5% p o - 4,5 - w d tot = 10% p o - 6,0 - w v p = 14,4 v d tot = 0,5% p o 4,5 5,5 - w d tot = 10% p o 6,0 7,0 - w r l = 2 w v p = 13,2 v d tot = 0,5% p o - 7,5 - w d tot = 10% p o - 10,0 - w v p = 14,4 v d tot = 0,5% p o 7,75 9,0 - w d tot = 10% p o 10,0 12,0 - w output power; without bootstrap notes 6, 8 and 9 r l = 4 w v p = 14,4 v d tot = 10% p o - 6 - w frequency response notes 3 and 6 - 3 db f r - 40 to > 20 k - hz supply voltage ripple rejection note 5 f = 1 khz svrr - 50 - db channel separation r s = 10 k w ; f = 1 khz a 40 50 - db closed loop voltage gain note 7 g c 39,5 40,0 40,5 db noise output voltage (r.m.s. value) f = 20 hz to 20 khz; r s = 0 w v n (rms) - 0,15 - mv r s = 10 k w v n (rms) - 0,25 - mv r s = 10 k w ; according to iec179 curve a v n (rms) - 0,2 - mv parameter conditions symbol min. typ. max. unit
january 1992 8 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ notes to the characteristics 1. if v 11 > v 10 then i 11 must be < 10 ma. 2. closed loop voltage gain can be chosen between 32 and 56 db (btl), and is determined by external components. 3. frequency response externally fixed. 4. the input impedance in the test circuit (fig.3) is typ. 100 k w . 5. supply voltage ripple rejection measured with a source impedance of 0 w (maximum ripple amplitude 2 v). 6. output power is measured directly at the output pins of the ic. 7. closed loop voltage gain can be chosen between 26 and 50 db (stereo), and is determined by external components. 8. a resistor of 56 k w between pins 3 and 7 is required for symmetrical clipping. 9. without bootstrap the 100 m f capacitor between pins 5 and 6 and the 100 m f capacitor between pins 8 and 9 can be omitted. pins 6 and 8 connected to pin 10.
january 1992 9 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ application information fig.3 test and application circuit; bridge tied load (btl). (1) belongs to power supply. fig.4 test and application circuit; stereo mode. (1) belongs to power supply.
january 1992 10 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ package outline unit a e 1 a 2 b p cd (1) e (1) z (1) de d h ll 3 m references outline version european projection issue date iec jedec eiaj mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 3.4 v 0.8 12.2 11.8 1.7 e 2 5.08 2.4 1.6 e h 6 2.00 1.45 2.1 1.8 3.4 3.1 4.3 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 12.4 11.0 sot141-6 0 5 10 mm scale q j 0.25 w 0.03 x d l e a c a 2 m l 3 q w m b p 1 d d z e 2 e e x h 113 j e h non-concave view b : mounting base side 92-11-17 95-03-11 dbs13p: plastic dil-bent-sil power package; 13 leads (lead length 12 mm) sot141-6 v m b
january 1992 11 philips semiconductors product speci?cation 24 w btl or 2 x 12 w stereo car radio power ampli?er TDA1510AQ soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). soldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. repairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.

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